JIS Z 3197 PDF

JIS Z Test methods for soldering fluxes (Foreign Standard). Available for Subscriptions. Content Provider Japanese Industrial Standards [JIS]. JIS Z Test methods for soldering fluxes (Foreign Standard. JIS Z Halide content(mass %). ~ JIS Z Copper plate corrosion test. Passed. JIS Z Insulation resistance test( Ω).

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Aqua-soluble core flux for used by assembly’s manufacturer utilizing water washing cleaning process. Post flux residues can be washed with lukewarm water O C.

JIS Z – Test methods for soldering fluxes (Foreign Standard)

Colophony type non-halide cleaning-free soldering flux js lead-free solder wire. The flux according to claim 1, wherein: Aqueous cleaning soldering flux for lead-free soldering and preparation method thereof.

Brass and copper for consumer product. Clear residue no-clean halide free flux used by assemblies’ manufacturer utilizing low solid no-clean wave soldering fluxes.

Water – soluble core flux. Low-splash and halogen-free welding agent for tin wires and preparation method thereof.

The residues left are near neutral pH and the core-flux can be utilized with an open torch flame or a soldering iron.

Flux for soldering electronic components on circuit substrates, and mounted or unmounted circuit substrate. Solder fillets can left up to 24 hours and still remains shiny prior sending for post washing with water.

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Halogen-free low-splash solder wire and preparation method of halogen-free low-splash solder wire. Halogen-free soldering agent for tin bismuth system unleaded tin paste and preparation method thereof. Aqua-soluble core flux was developed for used by assemblies’ manufacturer utilizing water-soluble wave soldering fluxes and aqua-soluble solder paste SME process The flux is thermally heat stable with minimal fumes and odor.

Low-rosin cleaning-free scaling powder for SnAgCu series lead-free soldering paste and preparation method thereof. This flux is a high activity, heat stable with minimal fumes and odor.

The said surface active agent is one or more of the nonion surface active agent, and the said organic amine and the derivant being ethanediamine, tetramethylenediamine, diethyl ethanolamine and so on, with the said film forming material being diethyl ethanolamine or resin. CN CNA en CN CNA en.

RM-5 (Flux for BGA / CSP Solder Ball)

More than 90 SnPb More than 80 Sn More than 90 SnPb. The said organic acid could be one or more of the aliphatic acid mono acid or bi-acid, s acid, or amino acid.

The soldering zz does not have halogen, being environmental protective, good in welding, welding spot being full and luminous, without residue, no corrosion, high in isolation resistance. Environment protection efficient water-based circuit board cleaning agent and preparation thereof. Preparation and use of the same method as in Example 1.

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CN101062536A – Non-halide cleaning-free welding flux for leadless solder – Google Patents

Halogen-free lead-free soldering paste nis radiator and preparation method thereof. A lead-free solder was washed with halogen-free flux, components of the flux by mass percentage: Fast and excellent instant wetting action used mainly by consumer products assemblies manufacturer. Ideally used mainly by consumer products assemblies’. The invention relates to a lead free soldering clean free soldering flux with the mass percentage of organic acid activating agent 1.

Clear residue core flux for lead-free alloy cored solder wire was developed for minimal spitting, fast and excellent instant wetting action, ideally suitable for critical products assemblies manufacturer requiring.

The film-forming substance in the raw material, i. The residua can be completely removed s luke-warm x water rinse. A soldering flux as claimed in claim 5, characterized in that: A flux according to claim 1, wherein: Brass and copper Brass and copper for consumer product.